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Pressure
Freescale Semiconductor Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXx5050 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.
MPX5050 Rev 10, 10/2009
MPX5050 MPXV5050 MPVZ5050 Series
0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 V Output
Features
* * * * * * 2.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated Over -40 to +125C Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option ORDERING INFORMATION
Case Device Name No. Unibody Package (MPX5050 Series) None # of Ports Single Dual Gauge Pressure Type Differential * * * * * * * * * Absolute Device Marking MPX5050D MPX5050DP MPX5050GP MPX5050GP MPXV5050GP MPXV5050DP MPXV5050G MPXV5050G MZ5050GW
MPX5050D 867 * MPX5050DP 867C MPX5050GP 867B MPX5050GP1 867B Small Outline Package (MPXV5050 Series)
* * *
MPXV5050GP 1369 * MPXV5050DP 1351 * MPXV5050GC6U 482A * MPXV5050GC6T1 482A * Small Outline Package (Media Resistant Gel) (MPVZ5050 Series) MPVZ5050GW7U 1560 *
(c) Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX5050D CASE 867-08
MPX5050GP CASE 867B-04
MPX5050DP CASE 857C-05
SMALL OUTLINE PACKAGES
MPVZ5050GW7U CASE 1560-02
MPXV5100GC6U CASE 482A-01
MPXV5050DP CASE 1351-01
MPXV5050GP CASE 1369-01
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Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)
Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 Volts Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2.Device is ratiometric within this specified excitation range. 3.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6.Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25C. TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. 7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. (0 to 85C) Symbol POP VS Io Voff Min 0 4.75 -- 0.088 Typ -- 5.0 7.0 0.2 Max 50 5.25 10 0.313 Unit kPa Vdc mAdc Vdc
(0 to 85C)
VFSO
4.587
4.7
4.813
Vdc
(0 to 85C)
VFSS
--
4.5
--
Vdc
(0 to 85C)
-- V/P tR Io+ -- --
-- -- -- -- -- --
-- 90 1.0 0.1 20 0.5
2.5 -- -- -- -- --
%VFSS mV/kPa ms mAdc ms %VFSS
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Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 -40 to +125 -40 to +125 Unit kPa C C
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 4, 5, and 6 are NO CONNECTS for Unibody Device Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device
Figure 1. Fully Integrated Pressure Sensor Schematic
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Pressure
On-chip Temperature Compensation and Calibration
Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050/MPXV5050G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
5.0 4.5 Transfer Function: Vout = VS*(0.018*P+0.04) ERROR 4.0 VS = 5.0 Vdc 3.5 TEMP = 0 to 85C 3.0 Output (V) 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 45 50 55 MAX MIN
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0x to 85xC using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
TYPICAL
Differential Pressure (kPa)
Figure 2. Output vs. Pressure Differential
Fluorosilicone Gel Die Coat Die Wire Bond P1 Stainless Steel Metal Cover Epoxy Plastic Case
Lead Frame
Differential/Gauge Element P2
Die Bond
Figure 3. Cross-Sectional Diagram (not to scale)
+5 V
Vout Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5050 Sensors Freescale Semiconductor 5
Pressure
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
(Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V 0.25 Vdc
Temperature Error Band
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 Temperature in C 80 100 120 140 Temp -40 0 to 85 +125 Multiplier 3 1 3
NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band
Error Limits for Pressure 3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 0 10 20 30 40 50 60 Pressure (in kPa)
Pressure 0 to 50 (kPa)
Error (Max) 1.25 (kPa)
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure
Part Number MPX5050D MPX5050DP MPX5050GP MPXV5050GP MPXV5050DP MPXV5050GC6U/T1
sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Case Type 867 867C 867B 1369 1351 482S Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Part Marking Vertical Port Attached
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Pressure
PACKAGE DIMENSIONS
-A-
4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
N -B- G
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-T-
SEATING PLANE
CASE 482A-01 ISSUE A UNIBODY PACKAGE
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 13.56 0.514 0.534 13.06 0.200 0.220 5.08 5.59 0.027 0.033 0.68 0.84 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 12.57 0.475 0.495 12.07 0.430 0.450 10.92 11.43 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N UNIBODY PACKAGE
MPX5050 Sensors Freescale Semiconductor 7
Pressure
PACKAGE DIMENSIONS
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CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX5050 8 Sensors Freescale Semiconductor
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CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX5050 Sensors Freescale Semiconductor 9
Pressure
PACKAGE DIMENSIONS
P 0.25 (0.010) X R
PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06
M
TQ
M
-A- U W L V
PORT #2 VACUUM (P2)
N
PORT #1 POSITIVE PRESSURE (P1)
-Q- B
PIN 1
1
2
3
4
5
6
K S
C
SEATING PLANE
-T-
-T- J
SEATING PLANE
G F
D 6 PL 0.13 (0.005)
M
A
M
VOUT GROUND VCC V1 V2 VEX
CASE 867C-05 ISSUE F UNIBODY PACKAGE
MPX5050 10 Sensors Freescale Semiconductor
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PACKAGE DIMENSIONS
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPX5050 12 Sensors Freescale Semiconductor
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CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
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CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
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CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
PAGE 2 OF 2 PAGE 2 OF 3
CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE
MPX5050 16 Sensors Freescale Semiconductor
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PACKAGE DIMENSIONS
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CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE
MPX5050 Sensors Freescale Semiconductor 17
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MPX5050 Rev. 10 10/2009

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